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HESSOPLAST® Verfahren zur galvanischen Kunststoffmetallisierung (Plating on Plastics) von ABS-, PC/ABS- und technischen Kunststoffen für dekorative und funktionale Kunststoffbeschichtungen in der Automobil-, Sanitär- und Industrieanwendung.
DR. HESSE company logo – specialist for electroplating, electrolytes and surface technology.

Plating on Plastics – Plastic Metallization

HESSOPLAST® for electroplating on ABS, PC/ABS and technical plastics.

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Benefits of HESSOPLAST® POP Pretreatment for Plastic Metallization

- Outstanding cost-effectiveness in plastic electroplating

- PFOS-free and resource-saving process management

- Very low palladium consumption in the activator process

- Lowest ammonia concentration for simplified wastewater treatment

- Short cycle times for efficient POP processes

- Easy integration into modern direct metallization lines

- Suitable for decorative and functional coatings on ABS, PC/ABS and technical plastics

The PFOS-free HESSOPLAST® POP pretreatment provides the basis for efficient and reliable plating on plastics. With very low palladium consumption, short cycle times and a low ammonia concentration, the system supports stable processes for the electroplating of ABS, PC/ABS and engineering plastics. This makes HESSOPLAST® particularly suitable for decorative and functional applications in the sanitary, automotive and fittings industries.

Etching (chromium-sulfuric acid)

Platzhalter

1

Etching (chromium-sulfuric acid)

Platzhalter

2

Etching (chromium-sulfuric acid)

Platzhalter

3

Etching (chromium-sulfuric acid)

Platzhalter

4

Rinsing

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5

Rinsing

Platzhalter

6

Rinsing

Platzhalter

7

Reduction

Platzhalter

8

Rinsing

Platzhalter

9

Rinsing

Platzhalter

10

Pre-dip hydrochloric acid

Platzhalter

11

Activator

Platzhalter

12

Rinsing

Platzhalter

13

Rinsing

Platzhalter

14

Accelerator 2C

Platzhalter

15

Accelerator 1C

Platzhalter

16

Rinsing

Platzhalter

17

Rinsing

Platzhalter

18

Electroless Nickel

Platzhalter

19

Electroless Nickel

Platzhalter

20

Rinsing

Platzhalter

21

Immersion Copper

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22

SCROLL / SWIPE

HESSOPLAST®

Example plant representation

HESSOPLAST® Anlagenkonzept für die Kunststoffmetallisierung mit kompakter POP-Prozesslinie. Prozessablauf von Beize, Aktivierung und Beschleunigung über chemisch Nickel bis zum Immersions-Kupfer für ABS-, PC/ABS- und technische Kunststoffe von DR. HESSE.

HESSOPLAST® Plant Concept for Efficient Plating on Plastics

Example of a highly space-saving POP process line – from etching, activation and acceleration through to electroless nickel and immersion copper.

Schematic illustration of an ABS and PC/ABS plastic surface pre-cleaned, pre-wetted and etched with DR. HESSE HESSOPLAST® PFOS-free wetting agent for reliable plastic plating.
ABS, PC/ABS etched

Features / Benefits:

  • Uniform cleaning and prewetting of the plastic surface

  • PFOS-free and compliant with current PFAS/PFOA restrictions

  • High process stability in precleaning and etching

  • No sludge formation; direct addition of the concentrate possible

  • Stable surface tension for reproducible etching results

  • Reliable preparation of ABS, PC/ABS and engineering plastics for plating on plastics

HESSOPLAST®

PFOS-free wetting agent for precleaning, prewetting and etching

Schematic illustration of the HESSOPLAST® reduction step after etching for ABS and PC/ABS plastics, ensuring reliable plastic plating with high process stability and extended bath life.
ABS, PC/ABS etched

Features / Benefits:

  • Extremely high stability in the reduction process

  • Free from sodium bisulfite

  • Low-odor process control

  • High tolerance to drag-in into the activation process

  • Long bath life for cost-efficient POP processes

  • Reliable reduction after etching of ABS, PC/ABS and engineering plastics

HESSOPLAST®

Reduction for plating on plastics

Schematic illustration of HESSOPLAST® palladium activation of ABS, PC/ABS, 1K and 2K plastics for reliable POP pre-treatment and plastic plating by DR. HESSE.
ABS, PC/ABS activated

Features / Benefits:

  • High selectivity: strong activation of the plastic surface without metallization of the rack insulation

  • One activator system for all plastics as well as 1K and 2K components

  • Lowest palladium consumption with a make-up concentration of 22–25 mg/l Pd

  • Extremely high stability against Cr6+ drag-in: stable up to 1,000 mg/l Cr6+

  • Reliable activation of ABS, PC/ABS and engineering plastics for plating on plastics

HESSOPLAST®

Activator for 1K and 2K plastics in POP pretreatment

Schematic illustration of the HESSOPLAST® accelerator process for ABS, PC/ABS, 1K and 2K plastics. Reliable acceleration after activation for plastic plating (POP) with high selectivity and long bath life by DR. HESSE.
ABS, PC/ABS accelerated

Features / Benefits:

  • Outstanding bath life in the 1K and 2K accelerator process

  • Excellent on-site analyzability of the individual components

  • High tolerance to drag-out into the subsequent electroless nickel process

  • Outstanding selectivity when plating 2K components

  • Free from strong complexing agents for simplified wastewater treatment

  • Simple wastewater treatment directly on site possible

  • Reliable acceleration of ABS, PC/ABS and engineering plastics

HESSOPLAST®

Accelerator for 1K and 2K components in plating on plastics

Schematic illustration of the HESSONIC® PP high-speed electroless nickel process for plastic plating (POP) of ABS, PC/ABS and engineering plastics. High deposition rate, excellent selectivity and up to 90% reduced ammonia consumption by DR. HESSE.
ABS, PC/ABS electroless nickel-plated

Features / Benefits:

  • At least 40% higher deposition speed in the electroless nickel process

  • Significantly reduced ammonia consumption, reduction by up to 90%

  • Outstanding selectivity in nickel plating of ABS, PC/ABS and engineering plastics

  • Outstanding stability, even at higher temperatures

  • Virtually unlimited bath life for cost-efficient POP processes

  • All additives can be analyzed on site, e.g. by titration, photometer or AAS/ICP

  • Simplified wastewater treatment due to reduced ammonia concentration

HESSONIC PP

High-speed electroless nickel for POP and plating on plastics

Schematic illustration of the HESSOPLAST® immersion copper process for plastic plating (POP) of ABS, PC/ABS and engineering plastics. Reliable pre-treatment with improved conductivity, excellent adhesion, long bath life and on-site analytical process control by DR. HESSE.
ABS, PC/ABS immersion copper plated

Features / Benefits:

  • Improved conductivity and adhesion before subsequent electroplating

  • Reduces defect patterns such as streaking and milkiness after copper deposition

  • Suitable for continuous operation in industrial POP process lines

  • Extreme bath life: up to 4 weeks in 24/7 operation

  • Can be analyzed on site for safe bath management and process control

  • Reliable pretreatment of ABS, PC/ABS and engineering plastics for plating on plastics

HESSOPLAST®

Immersion copper for POP processes and plating on plastics

Granulat aus technischen Kunststoffen als Symbolbild für die HESSOPLAST® Kunststoffvorbehandlung und die komplette POP-Prozesskette von DR. HESSE – von Beize, Reduktion und Aktivierung über Beschleuniger bis zu chemisch Nickel für ABS-, PC/ABS- und technische Kunststoffe.

Our POP Pretreatment for Plating on Plastics

HESSOPLAST® for the complete plating-on-plastics process chain – from etching, reduction and activation through to acceleration and electroless nickel.

Interested?

Our experts are available to provide you with advice and assistance.

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